Heat Sink Paste / Compound (250G) is a high-performance thermal interface material designed to improve heat dissipation between MCPCBs and heat sinks. Its soft, flexible, and highly thermally conductive composition ensures optimal heat transfer, enhancing the efficiency and lifespan of electronic components.
Key Features:
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High Thermal Conductivity – Promotes efficient heat dissipation
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Wide Temperature Range – Stable from -40℃ to 260℃
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Soft & Flexible – Ensures excellent contact for heat transfer
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Electrical Insulation – Safe for sensitive electronics
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Natural Stickiness – Stays in place for reliable performance
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Cost-Effective & Durable
Applications:
✔ LED bulbs and lighting systems
✔ CPU and GPU cooling solutions
✔ Thermal management in electronics
✔ Between MCPCB and heat sinks
Ideal for professional and DIY use, this 250G heat sink paste ensures reliable cooling for various applications.
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